HERMITICITY OF ELECTRONIC PACKAGES PDF
Six Sigma: Hermeticity Testing (Fine and Gross Leak) is used to determine the 1] H. Greenhouse, Hermeticity of Electronic Packages (William Andrew. As early as the s, SCHOTT’s Business Unit Electronic Packaging .. glass seal, for instance, hermeticity or seal strength, do not change as a result of. Electronic packaging is the design and production of enclosures for electronic devices ranging . Burn-in · Temperature cycling · Thermal shock · Solderability · Autoclave; Visual inspection; Hermeticity/moisture resistance.
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Punched and formed sheet metal is one of the oldest types of electronic packaging. Potting can be done in a pre-molded pavkages shell, or directly in a mold.
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It’s usually a dielectric fluid, chosen for chemical compatibility with the other materials present. This page was last edited on 31 Decemberat Gasketed metal castings are sometimes off to package electronic equipment for exceptionally severe environments, such as in heavy industry, aboard ship, or deep under water.
After the vacuum is released, the fluid flows into the part. Electronic packaging is the design and production of hermiticigy for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. These requirements extend beyond and interact with the electrical design.
It can be very economical, but somewhat difficult to achieve consistent process quality. The same electronic system may be packaged as a portable device or adapted for fixed mounting in an instrument rack or permanent installation. Industrial design Packaging Packaging microfabrication Chip carriers.
In earlier times it was often used to discourage reverse engineering of proprietary products built as printed circuit modules. Electronic packaging relies on mechanical engineering principles such as dynamics, stress analysis, heat transfer and fluid mechanics. Electrohic can be rigid or soft.
Six Sigma: Hermeticity Testing
It’s widely used on mass-produced items such as axial-lead resistors, and sometimes on printed circuit boards. Examples are injection molding, transfer molding, vacuum forming, and die cutting.
Today it is most widely used to protect semiconductor components from moisture and mechanical damage, and to serve as a mechanical structure holding the lead frame and the chip together. When void-free potting is required, it is common practice to place the product in a vacuum chamber while the resin is still liquid, hold a vacuum for several minutes to draw the air out of internal cavities and the resin itself, then release the vacuum.
The main application of vacuum impregnation porosity sealing is in boosting the dielectric strength of transformers, solenoids, lamination stacks or coils, and some high voltage components. In these, the individual diodes are mounted in an array that allows the device to produce a greater amount of luminous flux with greater ability to dissipate the resulting heat in an overall smaller package than can be accomplished by mounting LEDs, even surface mount types, individually on a circuit board.
The tool of choice is hedmiticity numerically controlled vertical milling machine, with automatic translation of computer-aided design CAD files to toolpath command files. Hermetic metal packaging began life in the vacuum tube industry, where a totally leak-proof housing was essential to operation.
In the design of electronic products, electronic packaging engineers perform analyses to estimate such things as maximum temperatures for components, structural resonant frequencies, and dynamic stresses and deflections under worst-case environments.
Many electrical products require the manufacturing of high-volume, low-cost parts such as enclosures or covers by techniques such as injection molding, die hermoticity, investment casting, and so on. Examples are integrated circuit chips in ceramic Dual In-line Package form, or complex hybrid assemblies of chip components on a ceramic base plate.
Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. An electronics assembly consists of component devices, circuit card assemblies CCAsconnectors, cables and components such as transformers, power supplies, relays, switches, etc. It is also commonly used in high voltage products to allow live parts to be placed closer together, so that the product can be smaller.
It’s relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.
Molded plastic cases and structural parts can be made by a variety of methods, offering tradeoffs in piece part cost, tooling cost, mechanical and electrical properties, and ease of assembly. Pl can be post-processed to provide conductive surfaces. Unsourced material may be challenged and removed.
Another use is to protect deep-submergence items such as sonar transducers from collapsing under extreme pressure, by filling all voids. It can be mechanically strong, provides electromagnetic shielding when the product requires that feature, and is easily made hdrmiticity prototypes and small production runs with little custom tooling expense.
Please help improve this article by adding citations to reliable sources. It is most commonly used in electronic toys and low-end devices.
Electronic packages are sometimes made by machining solid blocks of metal, usually aluminum, into complex shapes. Porosity Sealing or Resin Impregnation is similar to potting, but doesn’t use a shell or a mold. Packaging for aerospace, marine, or military systems imposes different types of design criteria. Liquid filling is sometimes used as an herjiticity to potting or impregnation.
Electronic packaging – Wikipedia
See Conformal coatingParylene. It consists of a drop of specially formulated epoxy  or resin deposited over a semiconductor chip and its wire bonds, to provide mechanical support and exclude contaminants such as fingerprint residues which could disrupt circuit operation.
They are fairly common in microwave assemblies for aerospace use, where precision transmission lines require complex metal shapes, in combination with hermetically sealed housings. This method is used mostly in very large electrical equipment such as utility transformers, to increase breakdown voltage. This type of packaging can also be divided into two main types: Atmospheric pressure collapses the voids and forces the liquid resin packagess all internal spaces.